Wafer fusion : materials issues and device results (CROSBI ID 240933)
Prilog u časopisu | izvorni znanstveni rad | međunarodna recenzija
Podaci o odgovornosti
Black, A. ; Hawkins, A.R. ; Margalit, N.M. ; Babić, Dubravko I. ; Holmes, A.L. ; Chang, Y.-L. ; Abraham, P. ; Bowers, J.E. ; Hu, E.L.
engleski
Wafer fusion : materials issues and device results
A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device results and characterizations of the fused interface between several groups of materials.
Semiconductor materials, Optical materials, Conducting materials, Wafer bonding, Lattices, Thermal resistance, Mirrors, Substrates, Wavelength division multiplexing, Semiconductor devices
nije evidentirano
nije evidentirano
nije evidentirano
nije evidentirano
nije evidentirano
nije evidentirano
Podaci o izdanju
3 (3)
1997.
943-951
objavljeno
1077-260X
10.1109/2944.640648