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Wafer Fusion for Surface-Normal Optoelectronic Device Applications (CROSBI ID 240951)
Prilog u časopisu | izvorni znanstveni rad | međunarodna recenzija
Babić, Dubravko I. ; Bowers, John. E. ; Hu, Evelyn L. ; Yang, Long ; Carey, Kent
Wafer Fusion for Surface-Normal Optoelectronic Device Applications // International journal of high speed electronics, 8 (1997), 2; 357-375. doi: 10.1142/S0129156497000135
Podaci o odgovornosti
Babić, Dubravko I. ; Bowers, John. E. ; Hu, Evelyn L. ; Yang, Long ; Carey, Kent
engleski
Wafer Fusion for Surface-Normal Optoelectronic Device Applications
This paper discusses the issues connected with the application of fusion bonding technology for surface-normal optoelectronic devices (III-V semiconductors). The InP/GaAs fusion bonding technology employed in the development of long-wavelength vertical-cavity lasers is described.
Fusion bonding technology ; Surface-normal optoelectronic devices
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Podaci o izdanju
8 (2)
1997.
357-375
objavljeno
0129-1564
10.1142/S0129156497000135