Wafer fusion for optoelectronic applications (CROSBI ID 650561)
Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija
Podaci o odgovornosti
Babić, D. I. ; Tan, I-H. ; Mirin, R.P. ; Bowers, J.E. ; Hu, E.L.
engleski
Wafer fusion for optoelectronic applications
This paper discusses the issues connected with the application of fusion bonding technology for surface-normal optoelectronic devices (III-V semiconductors). The InP/GaAs fusion bonding technology employed in the development of long- wavelength vertical-cavity lasers is described.
Fusion bonding technology ; Surface-normal optoelectronic devices
nije evidentirano
nije evidentirano
nije evidentirano
nije evidentirano
nije evidentirano
nije evidentirano
Podaci o prilogu
1995.
objavljeno
Podaci o matičnoj publikaciji
Proceedings of the 1995 Conference on Lasers and Electro-Optics
Podaci o skupu
1995 Conference on Lasers and Electro-Optics
pozvano predavanje
01.01.1995-01.01.1995
Baltimore (MD), Sjedinjene Američke Države
