engleski

Contribution to Safety Factor Analysis in Piezoelectric Crack Problem

Problem of defect such as dislocations, crack, cavities, and inhomogeneities, which may be produced in piezoelectric materials during their manufacturing process, can arise when the material is subjected to mechanical and electrical loads. Stress concentrations due to these defects can give rise to critical crack growth and subsequent mechanical failure. In fracture mechanics a crack is an absence of bonds between two neighboring atom layers. Stress distribution near the crack tip depends on the form of the fracture surface formation. In this article, stress intensity factor or safety factor has been calculated and plotted vs. stress for mode I of PZT-4 ceramic (piezoelectric material) as part of micro-sensors and nanorobots.

Stress intensity factor; PZT ceramic; crack; dislocation; micro-sensor; nanorobot

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