engleski

Design rules for utilizing conductor-backed co-planar waveguide lines on FR-4 substrate

Conductor-backed coplanar waveguide (CBCPW) transmission lines provide a promising alternative to microstrip lines, especially in terms of potential reduction of EMI/EMC problems. We investigate properties of CBCPW lines on FR-4 substrate through 2-D electromagnetic simulations and measurements. In particular, we examine the effectiveness of ground vias, connecting top-level ground patches with back-side ground, in suppressing unwanted propagation modes. For operation up to 10 GHz it is necessary to place vias at 6 mm pitch in order to avoid nulls in the frequency response of the lines. Similarly, bringing in the 2nd row of vias closer to the signal line improves frequency behavior. Simulations indicate that substrate thickness has little or no influence on the frequency behavior of lines. We have also implemented a set of extraction procedures for material and line parameters, which are based on VNA and TDR measurements. Finally , 3-D electromagnetic simulations indicate that the near-end and far-end voltage induced by an EM pulse is three times larger in microstrip than in CBCPW lines.

electromagnetic compatibility; coplanar waveguide

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