Application of Moldex3D for Thin-Wall Injection Moulding Simulation (CROSBI ID 533741)
Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija
Podaci o odgovornosti
Šercer Mladen ; Godec, Damir ; Bujanić, Božo
engleski
Application of Moldex3D for Thin-Wall Injection Moulding Simulation
The benefits associated with decreasing wall thicknesses below their current values are still measurable and desired even if the final wall thickness is nowhere near those of the aggressive portable electronics industry. It is important to note that gains in wall section reduction do not always occur without investment, in this case, in tooling and machinery upgrades. Equally important is the fact that productivity and performance benefits of reduced material usage, fast cycle times, and lighter weight can often outweigh most of the added costs. In order to eliminate unnecessary mould trials, minimize product development cycle, reduce overall costs and improve product quality, polymeric engineers use new CAE technology (Computer Aided Engineering). This technology is a simulation tool, which combines proven theories, material properties and process conditions to generate realistic simulations and produce valuable recommendations. Based on these recommendations, an optional combination of product design, material and process conditions can be identified. In this work, Moldex3D software was used for simulation of injection moulding in order to avoid potential moulding problems. The results gained from the simulation were used for the optimization of an existing product design, for mould development and for optimization of processing parameters, e.g. injection pressure, mould cavity temperature, etc.
Application Of Moldex3D For Thin-wall Injection Moulding Simulation
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Podaci o prilogu
1067 - 1072-x.
2007.
objavljeno
Podaci o matičnoj publikaciji
Proceedings of the 9th International Conference on Numerical Methods in Industrial Forming Processes
César de Sá, J.M.A. ; Santos, Abel D.
Porto: American Institute of Physics (AIP)
978-0-7354-0416-8
Podaci o skupu
Materials Processing and Design: Modeling, Simulation and Applications, NUMIFORM 2007
predavanje
17.06.2007-21.06.2007
Porto, Portugal