izvor podataka: crosbi
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Package modelling (CROSBI ID 764236)
Druge vrste radova | elaborat/studija
Mandić, Tvrtko ; Barić, Adrijan
Package modelling // Sveučilište u Zagrebu, Fakultet elektrotehnike i računarstva. 2008.
Podaci o odgovornosti
Mandić, Tvrtko ; Barić, Adrijan
engleski
Package modelling
The integrated circuit packages of the type SOP8 and SSOP8 are simulated by using CST Microwave Studio and Cadence PKG Tool. Simulations results are compared. A Visual Basic script is written to simplify the construction/definition of the package model. Special emphasis has been put on modelling the coupling between package pins and the method to correctly present the skin effect in the package leads.
SOP8; SSOP8; package modelling
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Podaci o izdanju
Sveučilište u Zagrebu, Fakultet elektrotehnike i računarstva
2008.
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objavljeno
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