engleski

Corrosion Behavior of the Filmed Copper Surface in Saline Water under Static and Jet Impingement Conditions

The nondestructive electrochemical impedance spectroscopy (EIS) method was used to study the influence of a surface film (spontaneously formed and modified by an inhibitor) on copper in a saline solution, pH 7.9, at the open circuit potential (EOCP) under static and fluid impingement conditions, i.e., under the real conditions of copper application. EIS parameters obtained in situ in a wide frequency range were correlated to the phenomena that occur simultaneously at different time scales: the charge transfer resistance, capacitance and the resistance to the transport of copper species through the film. The diffusion coefficient, the concentration of diffusing species, and the passive (corrosion) current density were calculated using the equations derived for the finite length Warburg impedance. The influence of turbulent flow on the anodic and cathodic kinetics of copper in a saline solution, pH 7.9, was discussed on the basis of potentiodynamic measurements.

copper; corrosion; electrochemical impedance spectroscopy; flow-accelerated corrosion; inhibitor film; jet impingement; oxide film; wall shear stress

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