Electro-thermal characterization and simulation of integrated multi trenched XtreMOS power devices (CROSBI ID 580682)
Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija
Podaci o odgovornosti
Rhayem, J. ; Besbes, B. ; Blečić, Raul ; Bychikhin, S. ; Haberfehlner, G. ; Pogany, D. ; Desoete, B. ; Gillon, R. ; Wieers, A. ; Tack, M. ;
engleski
Electro-thermal characterization and simulation of integrated multi trenched XtreMOS power devices
This paper presents a new methodology to characterize and simulate the electro-thermal aspects of packaged power drivers using multi- trenched XtreMOS devices. Electrical device data is collected by pulsed and DC measurements. Thermal data is collected through on-chip sensors -and through a full surface high resolution transient interferometric mapping (TIM). For the first time a data driven segmented electro- thermal transient model is proposed to describe accurately the thermal profile behavior for the mutli-trenched devices. Further investigations of the thermal heating impact on the driver due to the low thermal conductivity of the trenches (SiO<sub>2</sub>) have been carried out.
3D electro-thermal simulation; Integated power devices; SiO<sub>2</sub> trenches
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Podaci o prilogu
1-4.
2010.
objavljeno
Podaci o matičnoj publikaciji
Proceedings of Thermal Investigations of ICs and Systems (THERMINIC)
Barcelona: Institute of Electrical and Electronics Engineers (IEEE)
978-1-4244-8453-9
Podaci o skupu
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
predavanje
06.10.2010-08.10.2010
Barcelona, Španjolska
